Plasma R&D Process Engineering - Dry Etch / PECVD (all genders) // Job-ID: 228-1

As an R&D Process Engineer, you will take on challenging and responsible tasks with corresponding decision-making scope. You will work independently across all required activities, continuously expand your skill set, and contribute to the growing success of the team.

Your tasks include:

• Develop, optimize, and sustain plasma etch (dry etch) & deposition (PECVD) processes to support diverse R&D flows.
• Establish stable, repeatable process baselines and maintain tight control through SPC and regular performance monitoring.
• Own and maintain plasma tools, ensuring high uptime and process consistency.
• Define and document process parameters, recipes, and best practices to ensure reproducibility across experiments and flows.
• Collaborate with the process engineering team members to ensure process compatibility across the full fabrication flow.
• Lead troubleshooting, root cause analysis and continuous improvement activities to maintain high process quality and tool uptime.
• Support tool upgrades, new equipment acquisition, and capability expansion projects.

Your profile

• Master’s degree (Bachelor's degree with equivalent relevant experience) in Materials Science, Physics, Electrical Engineering, or related field.
• Minimum 3 years of experience as a plasma process engineer in an industrial or applied research semiconductor FAB; 5+ years preferred.
• Hands-on experience with plasma etch systems (e.g., ICP, RIE, PECVD).
• Proven ability to establish robust and transferable etch processes supporting multiple technologies.
• Proven experience with methodologies - process control, SPC, Problem Solving, CIP, Lean, equipment maintenance principles, etc.
• Demonstrated ability to work effectively in a research-driven environment supporting multiple stakeholders.
• Excellent teamwork, communication, reporting, and organizational skills.
• Analytical, detail-oriented, and proactive in driving process and equipment improvements.
• Willingness to relocate to Villach, Austria.

Important Facts about SAL

• Diverse research activities with many technical challenges.
• State-of-the-art laboratory facilities and equipment.
• Location in the heart of Europe in Austria
• Internal and external training opportunities for career development.
• Home office in Austria (max. 40%) and work from anywhere in the European Union possible (< 25%).
• Family & children friendly - actively shaping the compatibility of family and career.
• “Vital4SAL” to promote a healthy workplace (e.g. SAL coaching pool, trainings on mental health, physical activities, healthy snacks, 24/7 accident insurance)
• € 4 per day meal allowance in restaurants or € 2 per working day in supermarkets.
• Public transport initiative (subsidy for the “Klimaticket”)
• Our values: Open door policy, flexibility in working hours, casual dress code, diverse teams, working with people of different nationalities, informal communication, lifelong learning, compatibility of family and career, sustainability, personal growth, and collective advancement.

This position is subject to the Collective Agreement for employees in non-university research (Research CA) starting in occupational group E. We offer competitive salaries and additional benefits based on your experience and qualifications. For this position, your minimum monthly salary starts with EUR 3.963, paid 14 times a year.

Job details

Title
Plasma R&D Process Engineering - Dry Etch / PECVD (all genders) // Job-ID: 228-1

Employer
Silicon Austria Labs (SAL)

Location
Europas­traße 12 Villach, Austria

Published
2026-03-05

Application deadline
Unspecified

Job type
Engineer

Field
Nanotechnology, Electrical Engineering, Materials Engineering, Materials Physics, Plasma Physics,
Applied Physics