Academic Jobs - Home of Higher Ed Logo
University of Twente Jobs

University of Twente

PostDoc position on Wafer Bonding Physics for 3D Chip Integration

Closes:

Salary: €3,706 – €5,760 per month

48

Deadline: 17 Nov ’26   Published: [contact details available in the full listing]

Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked and interconnected to create faster, more compact and more energy-efficient semiconductor devices. However, the detailed mechanisms that determine bonding quality are still not sufficiently understood. In particular, the interplay between surface properties, wafer morphology, and the resulting bonding performance is still largely optimized empirically.

This is a Preview Listing…

Sign in for full job listing.

Finalise to make live.

Tell them AcademicJobs.com sent you!

About the employer

University of Twente Jobs

University of Twente

3.0 Star Employer Ranking
Visit the employer page

Hire Experts… Post a Job

Post a Job

Roles… Create a Job Alert

Related Jobs

View All Jobs