Research Fellow [Silicon Photonics and Packaging]

Job Description

The Department of Electrical and Computer Engineering (ECE) at the National University of Singapore (NUS) is seeking a Research Fellow to lead on the area of Silicon photonics and packaging. You will work closely with our researchers, students, and professors, including industry collaborators to understand and derive insights from scientific experiments and data. This is an exciting opportunity to work at the forefront of semiconductor photonics and advanced optical packaging in close collaboration with industry partners and academic researchers

Responsibilities will involve:

1. Research & Development

a) Conduct research on advanced optical coupling and packaging technologies for silicon photonics applications, including chip-to-chip and chip-to-fibre optical interconnections.

b) Develop and standardize simulation workflows and modelling templates using optical and multiphysics simulation tools, such as Zemax OpticStudio, Ansys Lumerical, and COMSOL Multiphysics.

c) Design and optimize optical coupling structures using Monte Carlo simulations and tolerance analysis to evaluate alignment sensitivity, manufacturing variations, and coupling efficiency.

d) Develop and optimize fabrication processes for novel optical coupling structures, incorporating Design for Manufacturability (DfM) and Design for Testability (DfT) principles to ensure scalability, process robustness, and reliability.

e) Design, develop, and implement optical characterization and testing setups to evaluate emerging chip-to-chip and chip-to-fibre coupling strategies, including coupling efficiency, alignment tolerance, and optical performance.

f) Supervise and mentor junior researchers and graduate students, providing technical guidance on research methodologies, simulation, fabrication, characterization, and related research activities.

2. Data Analysis & Reporting

g) Manage the collection, preprocessing, and large-scale analysis of optical experimental and simulation datasets.

h) Light cleanroom fabrication duties and characterization of fabricated devices.

i) Validate, benchmark and report on various optical coupling schemes.

j) Prepare technical reports, publications, and presentations for both academic and industry audiences.

3. Project Management & Collaboration

k) Contribute to project planning, timelines, and milestones.

l) Take responsibility for delivering research milestones within project timelines.

m) Serve as the primary liaison with industry partners to align objectives and ensure impactful outcomes.

4. Innovation & Intellectual Property

n) Drive innovation in diagnostic methodologies and failure analysis workflows.

o) Contribute to patent filings, technology disclosures, and commercialization efforts.

p) Publish findings in high-impact journals and present at leading conferences.

Qualifications

• Ph.D. or equivalent degree in the field of Microelectronics, Electrical Electronics and Engineering, Information and Communication Technology, Science, Physics, or its equivalent from a reputable University/Institute is preferred, or equivalent related experience.
• Experience in clean room fabrication, dry etch, wet etch, optical interconnects, fiber arrays, photonic packaging, semiconductor packaging, microelectronics, characterization, metrology, or reliability testing would be an advantage.
• Important simulation software:
  1. Zemax OpticsStudio
  2. Ansys Lumerical or COMSOL
• Advantageous software:
  1. 3D CAD tools
  2. Klayout or L-Edit
  3. General coding for data processing and scripting eg. MATLAB, C language and Python
• Excellent communication skills and the ability to work effectively in a collaborative research environment.
• Strong analytical, problem-solving, technical writing, and presentation skills.
• Self-motivated, able to work independently, and collaborate within a diverse team.
• Open to Fixed Term Contract.